HONNYRESIST SERIES
Electrocoat type photoresist
Product Information
Electrocoated photoresist with excellent adhesion,
high resolution and no pin-holing
HONNYRESIST is an electrodeposition solution for microfabrication derived from our industry-leading electrodeposition coating technologies developed for aluminum building materials. These technologies include electrodeposition resin synthesis technology, electrodeposition solution management technology, and electrodeposition process technology. This product exhibits adhesion superior to that of other electrodeposition solutions, making it suitable as a mask for plating and etching, an application that was not possible previously.
Features
Good throwing power on 3D structures
Excellent adhesion
High resolution
Pinhole-free
Chemical resistant
Applications
●Electronic parts such as connector and lead frame ●Fuel cell separator ●Printed-circuit board
Electronic parts(lead frame)
Enlarged view of lead frame
Printed-circuit board
Lineup
HONNYRESIST E SERIES
Electrodeposition surface coating agent for negative photoresist (cation)
HONNYRESIST AP SERIES
Electrodeposition surface coating agent for positive photoresist (anion)
